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1. ȯ°æº¸È£¸¦ À̳äÀ¸·Î ¼³°Ô, Á¦Á¶µÈ Lead free Soldering M/CÀÔ´Ï´Ù.
2. Lead free Àü¿ëÀ¸·Î ¼³°èµÈ Soldering M/CÀÔ´Ï´Ù.
3. ½Å·Ú¼ºÀÌ ³ôÀº ³³¶« ÀåÄ¡ÀÔ´Ï´Ù.
4. Solder POT´Â Snħ½ÄµîÀ» ¹æÁöÇϱâ À§ÇØ Æ¯¼öÇ¥¸é󸮸¦ Çß½À´Ï´Ù.
5. Lead free Àü¿ëÀ¸·Î Finger¸¦ Ư¼öÇÑ ¼³°è¸¦ Àû¿ëÇß½À´Ï´Ù.
6. Solder POTÀÇ ¿ÜºÎ¿¡ Heater¸¦ ºÎÂøÇÏ¿© Sn¿¡ ÀÇÇÑ Ä§½ÄÀ» ¹æÁöÇß½À´Ï´Ù.
7. »êÈ­¸¦ ¹æÁöÇϱâ À§ÇÏ¿© °£ÇæºÐ·ù¹æ½ÄÀ» Àû¿ëÇß½À´Ï´Ù.
8. Lead free ³³¶«¼±À» °í·ÁÇÏ¿© PREHEATER °¡¿­±¸°£À» ÃÖ´ë·Î È®º¸Çß½À´Ï´Ù.
9. ChipºÐ·ù¿Í 2Â÷ºÐ·ù »çÀ̸¦ ÃÖ¼ÒÈ­ ÇÒ ¼ö ÀÖµµ·Ï Chip NozzleÀ» °¡º¯ÇÒ ¼ö ÀÖµµ·Ï ¼³°èÀû¿ëÇß½À´Ï´Ù.
10. ControlºÎ-Touch Panel ä¿ëÀ¸·Î ±â´ÉÀÌ °­È­µÇ¾ú½À´Ï´Ù.
11. Solder Pot ±¸µ¿ºÎ°¡ One Touch ¹æ½ÄÀ¸·Î ºÐÇØÁ¶¸³ÀÌ ½±°Ô µÇ¾ú½À´Ï´Ù.

ITM-205LF OPTION
No. ITEM SPECIFICATION
1 F.D.C. AUTO FLUX DENSITY CONTROL
2 SPRAY FLUXER SWING TYPE
3 WAVE FLOW STAND-BY WAVE FLOW
4 AUTO UP DOWN SYSTEM Solder POT.FLUXER PART
5 ±Ý¼Ó³Ã°¢ÀåÄ¡ ¿¡¾îÄÜ TYPE
 
¡á INPUT CONVEYOR
CHAIN TYPE BELT TYPEÀ¸·Î »ç¿ëÀÚ°¡ Æí¸®ÇÑ TYPEÀ¸·Î ¼±ÅÃÇÒ ¼ö ÀÖ°Ô ÇÏ¿´´Ù.
¡á PRE-HEATER
¿¹¿­ ±¸°£À» ÃÖ´ëÇÑ È®º¸ÇÏ¿© LEAD FREE ³³¶«¿¡ ÃÖ´ëÇÑ À¯¸®ÇÏ°Ô ÇÏ°í °¡¿­±â´ÉÀ» ÃÖ´ë·Î Çâ»ó ½ÃÄ×´Ù.
2. º¸¿Â CORVER¸¦ ¿­°­È­À¯¸®·Î ÇÏ¿© ³»ºÎ¸¦ º¼¼öÀÖ°Ô ÇÏ°í ¼Õ½±°Ô ¿­¼ö ÀÖ°Ô ÇÏ¿© À¯¸® °ü¸®°¡ Æí¸®ÇÏ°Ô ÇÏ¿´´Ù.
¡á SOLDER POT UNIT
1. CHIP NOZZLE NORMAL NOZZLE·Î ±¸¼ºµÇ¾î ÀÖ´Ù.
³³¶«Ç°Áú Çâ»óÀ» À§ÇÏ¿© CHIP NOZZLE °¡º¯ÇÒ¼ö ÀÖµµ·Ï °³¹ßµÇ¾î ÀÖ´Ù.
2. Sn ħ½Ä¹æÁö¸¦ À§ÇÏ¿© Ư¼öÇ¥¸é ¿­Ã³¸®´Â ÇÏ¿´´Ù.
 
¡á SOLDER POT UNIT
³³Á¶ ±³Ã¼¸¦ ¼Õ½±°Ô Çϱâ À§ÇØ ¹è¼±À» ÄܳØÅÍ TYPEÀ¸·Î ÇÏ¿© ¾÷¹«ÀÇ È¿À²À» ³ô¿´´Ù.
¡á COOLING UNIT
1. »ó¸é°ú, ÇϺο¡ ±Þ¼Ó ³Ã°¢ ÇÒ¼ö ÀÖ´Â ÀåÄ¡¸¦ ¼³Ä¡ÇÏ¿© ±Þ¼Ó³Ã°¢ ½Ãų ¼ö ÀÖ°Ô Çß´Ù.
2. ³³Á¶¿¡ Âù °ø±â°¡ ³Ñ¾î°¡Áö ¾Êµµ·Ï ¿ªÇ³¹æÁö ÀåÄ¡¸¦ ¼³Ä¡ÇÏ¿© ³³¶«¼ºÀ» ÃÖ´ëÇÑ º¸¿Ï ÇÏ¿´´Ù.